ST-Ericsson Thor thin modems power three new Aquos smartphones
Geneva, Switzerland, – ST-Ericsson, a world leader in wireless platforms and semiconductors, is pleased to announce that Sharp has announced three new smartphones in Japan based on the ST-Ericsson Thor™ M5730 modem. With its low power consumption, this highly-integrated 21Mbps Thor modem will enable consumers to spend more time surfing the Internet at high-speeds and less time worrying about charging the battery.
“We have worked with Sharp for several years and are pleased that they have selected our Thor M5730 thin modem for their latest smartphones,” said Staffan Iveberg, senior vice president and head of the thin modems solutions division at ST-Ericsson. “We have had solid traction with our Thor HSPA+ 21Mbps thin modems at several leading smartphone manufacturers and are pleased to add Sharp to the list. As evidenced by these new phones, our HSPA+ modem technology is enabling our customers to produce sleek devices offering both high transmission speeds and long battery lives.”
ST-Ericsson’s Thor family of mobile broadband thin modems makes ultra-fast web browsing and high speed data connectivity ubiquitous, easy and reliable. The Thor M5730 modem, which brings improvement to the 21Mbps market in size, power consumption and thermal performance is capable of delivering 21Mbps downstream and 5.76Mbps upstream simultaneously, and needs no separate flash memory when combined with an application processor.
The AQUOS PHONE 102SH by Softbank and AQUOS PHONE SH-01D by DOCOMO are available now in Japan by their respective carriers. The AQUOS PHONE 104SH by Softbank is expected to be available in spring 2012.
ST-Ericsson is a world leader in developing and delivering a complete portfolio of innovative mobile platforms and cutting-edge wireless semiconductor solutions across the broad spectrum of mobile technologies. The company is a leading supplier to the top handset manufacturers and generated sales of $2.3 billion in 2010. ST-Ericsson was established as a 50/50 joint venture by STMicroelectronics (NYSE:STM) and Ericsson (NASDAQ:ERIC) in February 2009, with headquarters in Geneva, Switzerland.